
Shuttleline® Platform PECVD Supports Advanced Deposition Applications
Plasma-Therm continues to see strong momentum for the Shuttleline® platform, supporting advanced

Plasma-Therm continues to see strong momentum for the Shuttleline® platform, supporting advanced
Plasma-Therm continues to see strong momentum for the CHA platform, supporting advanced

St. Petersburg, FL – July 3, 2025 – Plasma-Therm, a global leader

Advanced Packaging for US Market – CHIPS ACT Microelectronics Commons NORDTECH Hub

Advancing Scientific Discovery and Technological Innovation St. Petersburg, FL, June 3, 2024

Plasma Dicing for Advanced Packaging May 29, 2024, Plasma-Therm LLC, a leading

The semiconductor and advanced manufacturing markets continue to evolve rapidly. As a result, Plasma-Therm remains focused on delivering solutions that help customers stay ahead. Looking ahead to 2026, several key areas will guide our strategy.
In today’s competitive landscape, research labs and workforce training programs need cutting-edge

What do microns, nanometers, and angstroms all have in common? They are

Customers have once again singled out Plasma-Therm as one of the industry’s

Today’s information age requires moving and manipulating vast amounts of data at

Plasma-Therm® now offers the Tegal™ Diode Reactive Ion Etching (RIE) systems. The