A RANGE OF ETCH, DEPOSITION, THERMAL AND ADVANCED PACKAGING PROCESS TECHNOLOGIES FOR MANUFACTURING OPTIONS TO ACHIEVE THE BEST PERFORMANCE POSSIBLE
At Plasma-Therm®, we do more than just offer you semiconductor and advanced packaging process equipment. We engage with you early to customize your systems and process technologies, so you get precisely the solutions you need. Our history, process technology expertise and broad portfolio of etch, deposition, dicing and rapid thermal processing systems put you ahead of the pack, from R&D to high-volume manufacturing.
ALL TECHNOLOGIES
ETCH
ICP
RIE
DSE™
IBE
ALE
HDRF™
Deposition
PECVD
HDPCVD
DSE™
IBE
ALE
HDRF™
THERMAL PROCESSING
RTP
Plasma Dicing
PDOT™
PDOC
PDBG
NEED ASSISTANCE?
Let our experts help you customize our processes solutions for your applications.