Assessing Deep Reactive Ion Etch (DRIE) at CNF

April 12, 2022

Assessing Deep Reactive Ion Etch (DRIE) at CNF

Cornell University’s Nanoscale Science and Technology Facility (CNF) recently took delivery of a VERSALINE® deep silicon dry etching system. The comprehensive assessment process described here took a year to complete.

Cornell NanoScale Science and Technology facility
Scroll to Top